Thermal Management of Electronics
Thermal Analysis - Part 1
In this article I will share with you the first step on how to very quickly evaluate your IoT connected device from a thermal point of view. To be more precise how to know if your product will not overheat for its entire operational life. To do this, the most effective approach will be the finite element method. The finite element modeling method requires the use of a CAD model. Nowadays most product designs have an engineering model developed. In some cases the CAD modeling tool used will have an integrated analyses module for it. If it does not, then I highly recommend Ansys, Solidworks, or MSC Patran/Nastran. There are many more analyses software out there, but what I will discuss here will apply to almost any tool.
In this article I will share with you the first step on how to very quickly evaluate your IoT connected device from a thermal point of view. To be more precise how to know if your product will not overheat for its entire operational life. To do this, the most effective approach will be the finite element method. The finite element modeling method requires the use of a CAD model. Nowadays most product designs have an engineering model developed. In some cases the CAD modeling tool used will have an integrated analyses module for it. If it does not, then I highly recommend Ansys, Solidworks, or MSC Patran/Nastran. There are many more analyses software out there, but what I will discuss here will apply to almost any tool.